Need for advanced materials to support the increasing demand for smaller, more powerful electronic devices
R&D Focus
High thermal conductivity ceramic packaging substrate
Innovative Solution
Lattice Grand’s main product is the high thermal conductivity ceramic packaging substrate based on the thin-film circuit manufacturing process
Solution Effectiveness
Lattice Grand product has the advantages of good heat dissipation, high flatness, high line accuracy, high density micron-channel, and high integration
Investment Funding
Last Funding Stage
Seed
Total Funding Amount
$7.84M
Last Funding Amount
$7.84M
Last Funding Date
December 30, 2021
Startup Stage
Early Stage
Lead Investors
GSR United Capital, Nanchang Opto Valley
Products
Product
Ceramic packaging substrate
Demo Product or Complete Product?
Complete Product
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